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Overview
This page contains some material which should support authors in preparing their paper for submission to ICFI'05.
Submission will be via CyberChair. Acceptable formats are postscript amd PDF. Authors without internet access should contact one of the workshop chairs for more information on the submission of hardcopy papers.
Technical papers will be
published as the 8th book in the series on Feature Interactions in
Telecommunication and Software Systems by IOS Press. Accepted papers must be
presented at the conference by one of the authors. Technical papers
submitted may be full papers
or short papers.
Full
papers. These must be unpublished and must not be submitted for
publication elsewhere. Submissions of full papers should not exceed 16
pages.
Short papers. In
order to make the conference as complete as possible from the point of
view of coverage of current research in the area, we also solicit short
papers. These can be industrial reports (I), position papers (P), or
summaries of research already published elsewhere (S). Such papers
should not exceed 5 pages but should be sufficiently self-contained to
be appreciated on their own. Each paper should be clearly labelled as
I, P, or S. Industrial reports should describe industrial case
studies or industrial research directions. Position papers should
propose novel research directions. Summaries should contain appropriate
citations.
All submissions must be in
English.
The general format required is described in: N. Nescio, Instructions for the Preparatioon of a Camera-Ready Manuscript. IOS Press, Amsterdam, 1991. This document is available as postscript or PDF document.
The publisher also provides a style file for Latex. User of Latex are encouraged to use this style file to format the paper according to the publisher's requirements. However, please note that changes to this Latex style are not acceptable!
Submitting the paper
Submission is a two phase process, in phase one authors register and submit an abstract and title. The paper is submitted in phase 2. There are more details available on the submissions pages.
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